RFID label packaging process
RFID label packaging process
RFID tags for different purposes presents a variety of packages, thus making the antenna, bump forming, die bonding and other packaging interconnect process technology also showed diversity.
(1) antenna manufacturing
Winding the antenna substrate (corresponding to wire bond packages)
Printed antenna substrate (corresponding to a conductive adhesive flip-chip package)
Etching the antenna substrate (corresponding to wire bond packages or modules riveting package)
(2) the formation of bump
Currently RFID tags are characterized by variety, but not the number of each species can form scale.
Therefore, the use of flexible production technologies with low-cost bumping, packaging, high efficiency, easy to use, flexible, simple process control, high degree of automation. Not only solve the microelectronics industry in the variable-volume processing, high-density, low-cost package needed problems, but also for the now burgeoning RFID tags provide the conditions of flexible production.
(3) RFID chip interconnect methods
RFID tag manufacturing's main objectives is to reduce costs. Therefore, we should minimize the process to select low-cost materials, reducing the process time.
Flip chip bump interconnect pad with flexible substrate can be used three ways: isotropic conductive adhesive (ICA) plus the bottom of the fill, anisotropic conductive adhesive (ACA, ACF), non-conductive adhesive (NCA) direct Lamination stud bumping method. In theory, the priority should be given NCA interconnect, you can achieve with the dispensing bumping compatible low-cost manufacturing, but there are some limitations and reliability.
Using ICA, the advantage of low cost, no pressure curing. Operation complicated process steps, it is difficult to reduce costs, often a long curing time, it is difficult to increase production speed. Used to first create a connection in the small chip substrate, and then connect with the large size of the antenna in the form of the substrate, adhesion to complete the circuit through the ICA is the preferred conduction. Usually low-cost, fast curing of ACF and ACA, the specific approach is to use ordinary leakage printing technology in the corresponding position in the antenna substrate pad brushing a layer of ACA, flip chip placement machine using the chip attached to an appropriate location, and hot curing.
There is another way of bonding is to first create a RFID module, and then assembled with the antenna substrate for riveting.
This information from szchinacard.com
