RFID tag packaging technology
1.1 RFID technical concepts
RFID card is the abbreviation RadioFrequencyIdentification that radio frequency identification technology, commonly known as RFID. Radio Frequency Identification RFID is a non-contact automatic identification technology, which RF signal automatic target recognition and access to relevant data, identify the work without human intervention, can work in harsh environments. RFID technology can identify fast moving objects can also identify multiple tags, the operation quickly and conveniently.
1.2 RFID an essential part of the system
The most basic RFID system consists of three parts: tag (Tag), reader (Reader), antenna (Antenna), a complete system need to have data transmission and processing systems.
1.3 RFID technology, the basic working principle
The basic principle of RFID technology is not complicated: label into the magnetic field, the receiver interpret the signals emitted by radio frequency, induced current obtained with the energy stored in the chip sends out product information, or to take the initiative to send a frequency signal; interpretation reads the information and decode the information sent to the central system for data processing.
2 RFID packaging technology
2.1 encapsulation method
Printed antenna with chip interconnect, due to the high frequency RFID tags, tiny chip, ultra-thin, the most appropriate method is to flip-chip (FlipChip) technology, which has a high-performance, low cost, miniaturization, high reliability characteristics, to meet the flexible substrate material, flip bonding conductive adhesive material to the chip and antenna pad to achieve the interconnection. Flexible substrate to achieve high-volume low-cost production, and in order to more effectively reduce production costs, a new approach to the antenna and chip interconnect is the international and domestic hot issue.
In order to meet the smaller size of RFID chips, effectively reduce production costs, the use of chip and antenna substrate bond package is divided into two modules are completed is the development trend. One specific approach are: large size of the antenna substrate and the substrate to connect small chips were manufactured in small pieces to complete the chip mounting substrate and interconnect, and then with the large size of the antenna substrate adhesion by a large pad of the complete circuit is pass. The process will be packaged with a two-module approach is similar to the chip can be transferred to the chip carrier spaced bearing belt, and then set out to bring the flip-chip attached to the antenna substrate. In this method, the flip chip is rolled by the way set out to achieve with the simplified chip pick-up operation, which can achieve higher productivity.
This information from szchinacard.com
